Warren S. Grundfest, MD, FACS
Physician & Scientist
UCLA Bioengineering/Elec Engr
BOX 951600, 7523 BH
Los Angeles, CA 90095-1600
Email: warrenbe@seas.ucla.edu
http://www.bioeng.ucla.edu
Biography
Dr. Grundfest is currently Professor of Biomedical Engineering, Electrical
Engineering, and Surgery at UCLA. He received his MD degree from Columbia
University in 1980 and trained in General Surgery at UCLA and Cedars-Sinai
Medical Center. He was appointed Assistant Director of Surgery at Cedars-Sinai
Medical Center and Assistant Clinical Professor of Surgery at UCLA in 1987.
He served as a Research Professor in Biomedical Engineering at University
of Southern California and as Visiting Associate in Mechanical Engineering
at California Institute of Technology.
From 1991-2001 Dr. Grundfest was the Director of the Cedars-Sinai Laser Research and Technology Development Program where he held the Dorothy and E. Philip Lyon Chair in Laser Research. Dr. Grundfest developed a broad range of laser, endoscopic, and minimally invasive surgical devices and techniques to improve the efficacy and decrease the pain and cost of medical therapies. He has received 15 patents for these efforts.
In 1994 he was inducted into NASA’s Space Technology Hall of Fame for the application of Excimer lasers to biologic systems. In 1996 he was elected Fellow, American Institute of Medical & Biologic Engineers (AIMBE), and Fellow, SPIE, for his work in biomedical photonics. Dr. Grundfest served as the first Chair of the UCLA Biomedical Engineering Program from 1999-2002.
Dr. Grundfest served as a member of the Surgery and Bioengineering Study Section of the NIH, external Co-Chair of the NIH BECON Consortium, and Chair of SPIE’s Biomedical Optics Conference for many years. Dr. Grundfest currently consults for the NIH and the FDA and serves as a Senior Technology Advisor to TATRC (Telemedicine and Technology Research Center of the Army). His current research efforts include the development of minimally invasive surgical tools, robotic systems, optical and ultrasonic sensors, haptic feedback systems, and biomedical photonics.